Heat Sinks Heat Spreaders Peltier Coolers

Heat Sink, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooling, Thermal Interface Materials, Computational Fluid Dynamics
Heat Sink, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooling, Thermal Interface Materials, Thermal Design Engineering Development


HEAT SINKS



A heat sink is a body, that more efficiently, absorbs and dissipates heat.



Daniel L. Thomas, founder of Novel Concepts, has been designing free convection and forced convection heat sinks , heat spreaders , Peltier coolers , and liquid cold plates since 1982, primarily focused on high efficiency cooling of high power density problems such as high efficiency (>90%) concentrated solar receivers, concentrated photovoltaics (solar cells), Peltier (thermoelectric) modules, high density LED arrays, power semiconductors, and microprocessors.

With forced convection heat sink volumetric efficiencies as high as 0.100 W/°C/cc (including fan), these compact heat sinks often replace active cooling systems.

Using SinkDes, proprietary shape optimization software developed by Thomas, in conjunction with Computational Fluid Dynamics (CFD) analysis, forced convection heat sinks can be modeled and optimized using any related design constraints. SinkDes, combined with CFD analysis, allows Novel Concepts to design heat sinks (compact heat exchangers) with unmatched thermal efficiency, as well as allowing us to quickly produce prototypes that are within 95% of predicted performance.

Novel Concepts has developed heat sinks for a wide variety of manufacturing methods, such as stamping, extruding, casting, powdered metallurgy, folded fins, and brazed convoluted fins. Design materials include metals, plastics, ceramics, and composites.

Very high performance designs may include active IsoSkin (thin flat heat pipe, or vapor chamber) heat spreader bases. The IsoSkin heat spreader base will increase the heat sink efficiency by reducing the thermal constriction resistance inherent in today's high power density applications.

One key advantage of using IsoSkin as a heat sink base is the freedom to place the cooling fins in any location. Since the thermal resistance between the heat source and any other location on the IsoSkin surface is nearly the same, fin placement can be governed by non-thermal design constraints such as the preferred fan location.








Heat Sink, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooled Heat Sink, Thermal Interface Materials, Thermal Design Engineering Development CLICK PICTURE FOR CLOSE UP AND TECHNICAL DETAILS



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Heat Sink, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooled Heat Sink, Thermal Interface Materials, Thermal Design Engineering Development
Heat Sink, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooled Heat Sink, Thermal Interface Materials, Thermal Design Engineering Development

PIN FIN HEAT SINKS


Heat Pipes, Thermoelectric Coolers, Vapor Chambers, Shape Optimization, Liquid Cooled Heat Sink, Thermal Interface Materials, Thermal Design Engineering Development

FREE CONVECTION HEAT SINKS


Heat Pipes, Thermoelectric Coolers, Vapor Chambers, Shape Optimization, Liquid Cooled Heat Sink, Thermal Interface Materials, Thermal Design Engineering Development

NATURAL CONVECTION HEAT SINKS

Heat Sink, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooled Heat Sink, Thermal Interface Materials, Thermal Design Engineering Development

VAPOR CHAMBER HEAT SINKS


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RADIAL HEAT SINKS


Heat Pipes, Thermoelectric Coolers, Vapor Chambers, Shape Optimization, Liquid Cooled Heat Sink, Thermal Interface Materials, Thermal Design Engineering Development

FORCED CONVECTION HEAT SINKS

Heat Sink, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooled Heat Sink, Thermal Interface Materials, Thermal Design Engineering Development

CAST ALUMINUM HEAT SINKS


Heat Pipes, Thermoelectric Coolers, Vapor Chambers, Shape Optimization, Liquid Cooled Heat Sink, Thermal Interface Materials, Thermal Design Engineering Development

CONVOLUTED FIN HEAT SINKS


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COPPER FOLDED FIN HEAT SINKS

Heat Pipes, Thermoelectric Coolers, Vapor Chambers, Shape Optimization, Liquid Cooled Heat Sink, Thermal Interface Materials, Thermal Design Engineering Development

ALUMINUM FOLDED FIN HEAT SINKS


Solid State Cooling, Microprocessor Coolers, Thin Film Heaters, LED Coolers, Liquid Cooled Heat Sink, Thermal Interface Materials, Thermal Design Engineering Development

COPPER FOLDED FIN HEAT SINKS


Solid State Cooling, Microprocessor Coolers, Thin Film Heaters, LED Coolers, Liquid Cooled Heat Sink, Thermal Interface Materials, Thermal Design Engineering Development

COPPER RADIAL FIN HEAT SINKS

Solid State Cooling, Microprocessor Coolers, Thin Film Heaters, LED Coolers, Liquid Cooled Heat Sink, Thermal Interface Materials, Thermal Design Engineering Development

COPPER RADIAL FIN HEAT SINKS


Thermal Management, Thermal Interface Materials, Heat Transfer, Thermal Consulting, Liquid Cooled Heat Sink, Thermal Interface Materials, Thermal Design Engineering Development

COPPER RADIAL FIN HEAT SINKS


Thermal Management, Thermal Interface Materials, Heat Transfer, Thermal Consulting, Liquid Cooled Heat Sink, Thermal Interface Materials, Thermal Design Engineering Development

COPPER RADIAL FIN HEAT SINKS














Thermal Management, Thermal Interface Materials, Heat Transfer, Thermal Consulting, Liquid Cooled Heat Sink, Thermal Interface Materials, Thermal Design Engineering Development
Photovoltaic Cooling, Thermal Calculators, Forced Convection, Natural Convection, Liquid Cooled Heat Sink, Thermal Interface Materials, Thermal Design Engineering Development
Photovoltaic Cooling, Thermal Calculators, Forced Convection, Natural Convection, Liquid Cooled Heat Sink, Thermal Interface Materials, Thermal Design Engineering Development