HEAT SINKS
Daniel L. Thomas, founder of Novel Concepts, has been designing free convection and forced convection heat sinks, heat spreaders, Peltier coolers, and liquid cold plates since 1982, primarily focused on high efficiency cooling of high power density problems such as concentrated photovoltaics (solar cells), Peltier (thermoelectric) modules, high density LED arrays, power semiconductors, and microprocessors.
With forced convection heat sink volumetric efficiencies as high as 0.10 W/°C/cc, these compact heat sinks often replace active cooling systems.
Using SinkDes, proprietary shape optimization software developed by Thomas, forced convection heat sinks can be modeled and optimized using any related design constraints. SinkDes allows Novel Concepts to design heat sinks (compact heat exchangers) with unmatched thermal efficiency, as well as allowing us to quickly produce prototypes that are within 95% of predicted performance.
Novel Concepts has developed heat sinks for a wide variety of manufacturing methods, such as stamping, extruding, casting, powdered metallurgy, bonded fins, folded fins, and brazed convoluted fins. Design materials include metals, plastics, ceramics, and composites.
Very high performance designs may include active IsoSkin (thin flat heat pipe, or vapor chamber) heat spreader bases. The IsoSkin heat spreader base will increase the heat sink efficiency by reducing the thermal constriction resistance inherent in today's high power density applications.
One key advantage of using IsoSkin as a heat sink base is the freedom to place the cooling fins in any location. Since the thermal resistance between the heat source and any other location on the IsoSkin surface is nearly the same, fin placement can be governed by non-thermal design constraints such as the preferred fan location.
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CLICK PICTURE FOR CLOSE UP
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CAST ALUMINUM HEAT SINKS
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CONVOLUTED FIN HEAT SINKS
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COPPER FOLDED FIN HEAT SINKS
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ALUMINUM FOLDED FIN HEAT SINKS
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COPPER FOLDED FIN HEAT SINKS
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COPPER RADIAL FIN HEAT SINKS
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COPPER RADIAL FIN HEAT SINKS
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COPPER RADIAL FIN HEAT SINKS
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COPPER RADIAL FIN HEAT SINKS
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, with a total thermal resistance of 0.29 °C/W. The volumetric thermal efficiency equals 0.013 W/°C/cc. Total weight 195 grams.'))
 heat sink. These copper convoluted fins are brazed onto a solid copper heat spreader. Developed for a tablet computer company, this low-cost copper heat sink measures 35mm by 15mm by 5mm, with a total thermal resistance of 1.83 °C/W. This heat sink was optimized for 1.25 CFM at 0.35 inches of water. The volumetric thermal efficiency equals 0.208 W/°C/cc. Total weight 7.5 grams.'))
 heat sink. These copper folded fins are brazed to a solid copper heat spreader (base). Developed for the Pentium 4 Processor with HT Technology Extreme Edition, this low-cost copper heat sink measures 78mm by 31mm by 40mm, with a total thermal resistance of 0.209 °C/W. This heat sink was optimized for 9.0 CFM at 0.31 inches of water. The volumetric thermal efficiency equals 0.049 W/°C/cc. Total weight 345.5 grams.'))
 heat sink. These aluminum folded fins are brazed to a solid aluminum heat spreader (base). Developed for the Pentium 4 Processor with HT Technology Extreme Edition, this low-cost aluminum heat sink measures 78mm by 31mm by 40mm, with a total thermal resistance of 0.292 °C/W. This heat sink was optimized for 8.7 CFM at 0.32 inches of water. The volumetric thermal efficiency equals 0.035 W/°C/cc. Total weight 104.4 grams.'))
 heat sink. These copper folded fins are brazed to a solid copper heat spreader (base). Developed for a Pentium 4 server application, this low-profile low-cost copper heat sink measures 78mm by 31mm by 20mm high, with a total thermal resistance of 0.275 °C/W. This heat sink was optimized for 7.7 CFM at 0.37 inches of water. The volumetric thermal efficiency is 0.069 W/°C/cc. Total weight 203.9 grams.'))
. Developed for a Pentium server application, this very-low-profile low-cost copper heat sink measures 47mm in diameter by 14mm high, with a total thermal resistance of 0.556 °C/W. This heat sink was optimized for a 32mm radial blower. The volumetric thermal efficiency is 0.023 W/°C/cc. Total weight 88.7 grams, including blower.'))
. Developed for a Pentium computer application, this low-profile low-cost copper heat sink measures 60mm in diameter by 40mm high (including fan), with a total thermal resistance of 0.610 °C/W. This heat sink was optimized for a 60mm by 25mm tubaxial fan. The volumetric thermal efficiency is 0.062 W/°C/cc. Total weight 302.0 grams, including fan.'))
, and has a total thermal resistance is 0.15 °C/W. The volumetric thermal efficiency is 0.046 W/°C/cc. Total weight 170 grams (including fan).'))
 heat sink has a total thermal resistance of 0.36 °C/W. The volumetric thermal efficiency is 0.026 W/°C/cc. Total weight 397 grams (including fan).'))