Heat Sinks Heat Spreaders Peltier Coolers

Heat Sink, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooling, Thermal Interface Materials, Computational Fluid Dynamics
Heat Sink, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooling, Thermal Interface Materials, Thermal Design Engineering Development


HEAT SPREADERS



A heat spreader is a device that improves the distribution of heat.

Novel Concepts has developed and patented IsoSkin™, a thin planar superconducting heat spreader, also known as vapor chambers or flat heat pipes. IsoSkin has an effective thermal conductivity as high as 10,000 W/m*K.

As thin as 500 microns, these IsoSkin heat spreaders can be used to replace the skin (outer shell) of portable electronics, often eliminating the need for heat sinks and fans. These thin flat IsoSkin heat pipes are also being used to dramatically improve heat sink and cold plate performance, by reducing the thermal constriction resistance inherent in high power density applications such as microprocessors, solid state thermoelectric Peltier coolers, LEDs, and power semiconductors.

IsoSkin may exhibit variable thermal conductivity, having either a positive temperature coefficient (PTC), or a negative temperature coefficient (NTC). The variable thermal conductivity of these materials may range from 1 to 1,000's of W/m*K, and may have an order of magnitude (10X) change in thermal conductivity with as little as 20°C change. These variable thermal conductivity materials may be controlled by numerous independent variables including temperature, power, and force.

"Novel Concepts solved the engineering dichotomy associated with the wick structures used in traditional vapor chambers and heat pipes ), by inventing a capillary fluid structure separate from the heat transfer structure. By separating the fluid transport structure from the heat transfer structure, these separate structures may be independently optimized, instead of being mutually dependent." (Daniel Thomas, Chief Technology Officer)

The planar capillary in the IsoSkin heat spreaders have such high liquid transport capacity, that additional internal heat transfer microstructures are not required for applications having power densities less than 20 watts per square centimeter.

As thin as a U.S. penny (1.5 millimeters), IsoSkin™ superconducting heat spreaders are capable of transferring over 250 watts, with a thermal conductivity 20 times greater than copper , and 4 times greater than the highest purity diamond. IsoSkin is also 60% lighter than copper, facilitating current thinner and lighter design trends.








Heat Sinks, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development CLICK PICTURE FOR CLOSE UP AND TECHNICAL DETAILS






IsoSkin™ Superconducting Heat Spreader™

(based on 162mm x 162mm x 1.5mm sized unit)
(heated on one edge, cooled on opposing edge)

Heat Sinks, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development






Heat Sinks, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development

ISOSKIN THERMAL PROFILE


Heat Pipes, Thermoelectric Coolers, Vapor Chambers, Shape Optimization, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development

COPPER THERMAL PROFILE


Heat Pipes, Thermoelectric Coolers, Vapor Chambers, Shape Optimization, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development

ALUMINUM THERMAL PROFILE

Heat Pipes, Thermoelectric Coolers, Vapor Chambers, Shape Optimization, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development

500 MICRON THICK ISOSKIN


Solid State Cooling, Microprocessor Coolers, Thin Film Heaters, LED Coolers, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development

500 MICRON THICK ISOSKIN


Solid State Cooling, Microprocessor Coolers, Thin Film Heaters, LED Coolers, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development

500 MICRON THICK ISOSKIN

Solid State Cooling, Microprocessor Coolers, Thin Film Heaters, LED Coolers, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development

500 MICRON THICK NOTEBOOK COOLERS


Thermal Management, Thermal Interface Materials, Heat Transfer, Thermal Consulting, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development

LOW PROFILE HEAT PIPES


Thermal Management, Thermal Interface Materials, Heat Transfer, Thermal Consulting, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development

INTERNAL NOTEBOOK VAPOR CHAMBERS

Thermal Management, Thermal Interface Materials, Heat Transfer, Thermal Consulting, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development

MICROPROCESSOR HEAT SPREADERS


Photovoltaic Cooling, Thermal Calculators, Forced Convection, Natural Convection, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development

MICROPROCESSOR VAPOR CHAMBERS


Photovoltaic Cooling, Thermal Calculators, Forced Convection, Natural Convection, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development

DIE LEVEL HEAT SPREADERS














Photovoltaic Cooling, Thermal Calculators, Forced Convection, Natural Convection, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development
Aerospace Coolers, Thermal Engineering, Diamond Spreaders, Bonded Fins, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development
Aerospace Coolers, Thermal Engineering, Diamond Spreaders, Bonded Fins, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development