Heat Sink Design, Liquid Heat Sinks, Heat Spreaders, Peltier Coolers

Heat Sink, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooling, Thermal Interface Materials, Computational Fluid Dynamics
Heat Sinks, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooling, Thermal Interface Materials, Thermal Design Engineering Development





Novel Concepts develops, designs, and optimizes thermal management technologies.

Since 1982, over 500 million thermal management devices have been manufactured by our clients, using our thermal management designs and technologies.

With a core focus on computational fluid dynamics (CFD) integrated with proprietary computer shape optimization, Novel Concepts continues to solve the industry's most difficult thermal challenges.

Examples of typical thermal management technologies we have developed for our clients include:

  • world's thinnest integrated fan heat sinks (patented)
  • world's thinnest active heat spreader (patented)
  • world's most thermally conductive plastic (patented)
  • world's thinnest forced convection heat sinks (patent pending)
  • recessed LED light cooler with asymmetrical air flow (patent pending)
  • low cost photovoltaic heat sinks and concentrated photovoltaic array cooling
  • lightweight liquid cooled cold plates and air cooled heat sinks, for military robotics
  • Peltier coolers (solid state thermoelectric coolers)
  • low stress heat sinks for large Peltier cooler arrays
  • high density LED array coolers (LED heat sinks)
  • microfluidic cooling plates (microchannel heat sinks)
  • notebook, desktop, and handheld microprocessor coolers
  • diffusion bonded copper heat sinks
  • variable thermal conductivity materials (both PTC and NTC)
  • wearable thermal signaling devices
  • general microelectronic thermal engineering and consulting services
  • lightweight compact heat exchangers for aerospace and avionics
  • programmable Peltier laser chillers for wafer fabrication
  • computer enclosures for the Alaska pipeline
  • vortex coolers for high contamination environments
  • solid state temperature sensors for data acquisition
  • microprocessor thermal test vehicles (TTV) for cooling research
  • overclocking heatsink development, including copper vaporchamber heatsinks
  • thin film and thick film heaters, on alumina, beryllia, and aluminum nitride
  • all-polyimide low thermal time constant heaters
  • transparent sapphire heaters
  • transient phase change heat sinks




Heat Sink, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooling, Thermal Interface Materials, Thermal Design Engineering Development

THINSINK™
(world's thinnest fan/sink)

Heat Sinks, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooling, Thermal Interface Materials, Thermal Design Engineering Development

HEAT SINKS


Heat Sink, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooling, Thermal Interface Materials, Thermal Design Engineering Development

HEAT SPREADERS
(world's thinnest heat pipe)

Heat Pipes, Thermoelectric Coolers, Vapor Chambers, Shape Optimization, Liquid Cooling, Thermal Interface Materials, Thermal Design Engineering Development

PELTIER COOLERS

Heat Pipes, Thermoelectric Coolers, Vapor Chambers, Shape Optimization, Liquid Cooling, Thermal Interface Materials, Thermal Design Engineering Development

THERMAL INTERFACE MATERIALS


Heat Pipes, Thermoelectric Coolers, Vapor Chambers, Shape Optimization, Liquid Cooled, Thermal Interface Materials, Thermal Design Engineering Development

LIQUID COOLED HEAT SINKS


Solid State Cooling, Microprocessor Coolers, Thin Film Heaters, LED Coolers, Liquid Cooled, Thermal Interface Materials, Thermal Design Engineering Development

MISCELLANEOUS THERMAL DEVICES


Solid State Cooling, Microprocessor Coolers, Thin Film Heaters, LED Coolers, Liquid Cooled, Thermal Interface Materials, Thermal Design Engineering Development
Solid State Cooling, Microprocessor Coolers, Thin Film Heaters, LED Coolers, Liquid Cooled, Thermal Interface Materials, Thermal Design Engineering Development
Thermal Management, Thermal Interface Materials, Heat Transfer, Thermal Consulting, Liquid Cooled, Thermal Interface Materials, Thermal Design Engineering Development