LIQUID COOLED HEAT SINKS
Daniel L. Thomas, founder of Novel Concepts, has been designing forced microfluidic cold plates (liquid cooled heat sinks) since 1982, primarily focused on high efficiency cooling of high power density problems such as concentrated photovoltaics (solar cells), Peltier (thermoelectric) modules, high density LED arrays, power semiconductors, and microprocessors.
Having a volumetric efficiency as high as 20.0 W/°C/cc, these forced microfluidic cold plates often replace complete refrigeration systems.
Using SinkDes, proprietary shape optimization software developed by Thomas, liquid cooled cold plates can be modeled and optimized using any design constraints. SinkDes allows Novel Concepts to design cold plates and heat sinks with unmatched thermal efficiency (up to 95%), as well as quickly produce prototypes that are within 90% of predicted performance.
Novel Concepts has developed cold plates and liquid cooled heat sinks for a wide spectrum of manufacturing methods, such as stamping, extruding, casting, powdered metallurgy, bonded fin, and brazed convoluted fin. Design materials for these liquid cooled cold plates include metals, plastics, ceramics, or any combination thereof.
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COPPER HEAT SINKS
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ALUMINUM COLD PLATES
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MINIATURE COPPER HEAT SINKS
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THIN MOLYBDENUM COLD PLATES
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ALUMINUM HEAT SINKS
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STAINLESS STEEL HEAT SINKS
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THIN COPPER HEAT SINKS
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IMPINGEMENT HEAT SINKS
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LOW PRESSURE DROP HEAT SINKS
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. SinkDes (proprietary shape optimization software) was used to optimize the internal fluid circuit geometry, resulting in this very compact design. Developed for cooling Peltier (thermoelectric) modules or other high power density devices, this liquid cooled copper heat sink has a total thermal resistance of 0.027 °C/W, with a flow rate of 0.5 liters per minute, and a pressure drop of 23.78 kPa (3.45 psi). The volumetric thermal efficiency is 2.14 W/°C/cc. Total weight 99.7 grams.'))
. SinkDes was used to optimize the internal fluid circuit geometry, resulting in this very compact design. Developed for cooling four Peltier (thermoelectric) modules or other high power density devices, this liquid cooled aluminum heat sink has a total thermal resistance of 0.0097 °C/W, with a flow rate of 1.0 liters per minute, and a pressure drop of 55.6 kPa (8.1 psi). The volumetric thermal efficiency is 0.72 W/°C/cc. Total weight 237.4 grams.'))
. SinkDes was used to optimize the internal fluid circuit geometry, resulting in this very compact design. Developed for cooling small Peltier (thermoelectric) modules or other high power density devices, this liquid cooled copper heat sink has a total thermal resistance of 0.074 °C/W, with a flow rate of 1.0 liters per minute, and a pressure drop of 41.1 kPa (6.0 psi). The volumetric thermal efficiency is 5.67 W/°C/cc. Total weight 15.3 grams.'))
. SinkDes was used to optimize the internal fluid circuit geometry, resulting in this very thin and compact design. Developed for cooling microproccessors or other high power density devices, this thin liquid cooled molybdenum heat sink has a total thermal resistance of 0.033 °C/W, with a flow rate of 1.0 liters per minute, and a pressure drop of 66.7 kPa (9.7 psi). The volumetric thermal efficiency is 12.37 W/°C/cc. Total weight 19.2 grams.'))
 modules or other high power density devices, such as microproccessors and semiconductors, this liquid cooled aluminum heat sink has a total thermal resistance of 0.0086 °C/W, with a flow rate of 2.0 liters per minute, and a pressure drop of 68.9 kPa (10.0 psi). The volumetric thermal efficiency is 1.30 W/°C/cc. Total weight 178.4 grams.'))
. SinkDes was used to optimize the internal fluid circuit geometry, resulting in this very compact design. Developed for cooling 300mm diameter semiconductor wafers or other high power density devices, this liquid round stainless steel heat sink has a total thermal resistance of 0.0041 °C/W, with a flow rate of 5.0 liters per minute, and a pressure drop of 69.8 kPa (10.1 psi). The volumetric thermal efficiency is 0.35 W/°C/cc. Total weight 4,270 grams.'))
. SinkDes was used to optimize the internal fluid circuit geometry, resulting in this very thin and compact design. Developed for cooling microproccessors, Peltier modules, or other high power density devices, this thin liquid cooled copper heat sink has a total thermal resistance of 0.019 °C/W, with a flow rate of 1.0 liters per minute, and a pressure drop of 239.3 kPa (34.7 psi). The volumetric thermal efficiency is 9.54 W/°C/cc. Total weight 26.7 grams.'))
. SinkDes was used to optimize the internal fluid circuit geometry, resulting in this very compact design. Developed for cooling small electronic devices, Peltier (thermoelectric) modules or other high power density devices, such as microproccessors and semiconductors, this liquid cooled copper impingement heat sink has a total thermal resistance of 0.083 °C/W, with a flow rate of 5.0 liters per minute, and a pressure drop of 95.0 kPa (13.8 psi). The volumetric thermal efficiency is 1.34 W/°C/cc. Total weight 58.0 grams.'))
. SinkDes was used to optimize the internal fluid circuit geometry, resulting in this very compact and low flow rate design. Developed for cooling small electronic devices, Peltier (thermoelectric) modules or other high power density devices, such as microproccessors and semiconductors, this liquid cooled copper heat sink has a total thermal resistance of 0.033 °C/W, with a flow rate of 0.5 liters per minute, and a pressure drop of 103.9 kPa (15.1 psi). The volumetric thermal efficiency is 2.42 W/°C/cc. Total weight 70.0 grams.'))