Heat Sinks, Heat Spreaders, Peltier Coolers, Cold Plates, Heat Pipes







Heat Sinks, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development

PATENTS



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  • US 4,782,893
    Electrically insulating thermally conductive pad for mounting electronic components

  • US 5,288,203
    Low profile fan body with heat transfer characteristics

  • EPC 746,688
    Low profile fan body with heat transfer characteristics

  • EPC 749,675
    Low profile fan body with heat transfer characteristics

  • US 5,484,262
    Low profile fan body with heat transfer characteristics

  • JP 8,502,804
    Low profile fan body with heat transfer characteristics

  • EPC 746,688
    Low profile fan body with heat transfer characteristics

  • JP 10,500,252
    Low profile fan body with heat transfer characteristics

  • CA 2,147,752
    Low profile fan body with heat transfer characteristics

  • US 6,158,502
    Thin, planar heat spreader

  • US 6,167,948
    Thin, planar heat spreader

  • JP 10,523,782
    Thin, planar heat spreader

  • CA 2,272,260
    Thin, planar heat spreader

  • KR 488,055
    Thin, planar heat spreader

  • Additional US and Foreign Patents Pending

Heat Sinks, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development
Heat Sinks, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development
Heat Sinks, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development