Heat Sinks Heat Spreaders Peltier Coolers

Heat Sink, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooling, Thermal Interface Materials, Computational Fluid Dynamics
Heat Sink, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooling, Thermal Interface Materials, Thermal Design Engineering Development


THERMAL INTERFACE MATERIALS



Novel Concepts has been developing thermal interface materials since 1982, including a patented diamond filled polyimide interface for high power density electronics and semiconductor applications. Specializing in high-value challenging applications such as, an avionics hard drive vibration-isolating/gap-filling problem that required a 7.5mm thick pad with a thermal conductivity of 3.0 W/m*K, and an outgassing vapor pressure less than 1.0E-4 Pa (better than NASA's optical outgassing specifications).

Novel Concepts has developed Metalomer, a thin compliant thermal interface material. With a thermal conductivity as high as 50 W/m*K, Metalomer is able to bridge the gap between traditional dry interface materials and metal solders.

Metalomer is the first thermal interface material with variable electrical and thermal properties on the same pad. In addition Metalomer may have dissimilar electrical and thermal regions on a single pad. This allows for an electrically conductive high thermal conductivity region adjacent to a high thermal conductivity dielectric region.

Metalomer may also have high density electrical interconnect regions for low insertion force connector applications such as LCD and EL displays, chip-to-board, memory cards, and flex circuit-to-board.










Heat Sinks, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development CLICK PICTURE FOR CLOSE UP AND TECHNICAL DETAILS
Heat Sinks, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development
Heat Sinks, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development

METALOMER THERMAL INTERFACE


Heat Sinks, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development

MULTIPHYSICAL METALOMER


Heat Sinks, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development

DIAMOND FILLED POLYIMIDE FILM














Heat Sinks, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development
Heat Sinks, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development
Heat Sinks, Peltier Coolers, Cold Plates, Heat Spreaders, Liquid Cooled Heat Sinks, Thermal Interface Materials, Thermal Design Engineering Development